Differences between Vertical and Horizontal Electroplating

Differences between Vertical and Horizontal Electroplating

Vertical and horizontal plating systems have distinctly different distribution problems. With the vertical process, racking is simple for short or medium-length parts; tank loading is rapid and hydrogen bubbles are quickly released. The vertical system is suited for inside plating because particles suspended in the solution do not readily adhere to vertical surfaces; hydrogen escapes easily from vertical slots, grooves, keyways, and flutes. Neither the anode nor cathode is prone to sag and plating time is typically short.

Disadvantages for vertical systems include the need for a large power supply and a deep pit or a high headroom. Introducing current to the bottom end of the workpiece may be troublesome. A long workpiece is difficult to center between anodes. If short pieces are plated with long anodes, the unused anode area tends to scale and forms a nonconductive coating. Long abodes are prone to warp unless rotated at regular intervals, are difficult to inspect, and require a hoist for examination.


Horizontal systems facilitate contacts at both ends of the work. More than one part can be plated at a time with simple racks. anode-cathode spacing generally is easier to adjust. Local anodes for recessed areas are easier to install and connect to separate power sources if desired. Despite these advantages, horizontal plating is limited to thin deposits unless fixtures can be oscillated or rotated because unagitated parts are prone to pit on bottom areas or become rough on top surfaces. Horizontal processes require more floor space and cad result in an inferior radial distribution. Some shops install both types of systems in order to capitalize on the advantages of each.