The Solutions Used for Palladium and Platinum Electroplating

 The Solutions Used for Palladium and Platinum Electroplating

Palladium plating solutions are categorized as ammoniacal, chelated, or acid. Ammoniacal palladium plating baths contain palladium ammonium nitrate or palladium ammonium chloride, and current densities range from 1 to 25 A/m2. Palladium acid plating baths contain palladium chloride, and current densities range from 1 to 10 A/m2.

Palladium alloys readily with other metals, the most important of which is nickel. Palladium nickel electroplating baths contain 3 g/L of palladium metal and 3 g/L of nickel metal.

The solutions used for platinum plating are similar to those used for palladium plating. Plating baths contain 5.0 to 20 g/L of either dinitroplatinite sulfate or chloroplatinic acid, and current densities range from 1 to 20 A/m2.