Alkaline and Acid Plating Solutions Used for Zinc Plating Process

Alkaline and Acid Plating Solutions Used for Zinc Plating Process

Alkaline and Acid Plating Solutions Used for Zinc Plating Process These are two general plating baths types: one utilizes an acid electrolyte and the other an alkaline electrolyte. The former is known as sulfate, sulfate-chloride, chloride, chloride-acetate, and fluoborate baths, depending upon their chief constituents. The alkaline electrolytes are mostly cyanide baths, although zincate and pyrophosphate baths also have their advocates. The choice between the types used is based upon a number of factors. For instance, in consid

The Generation of Emissions in Plating Process and Controls Method

The Generation of Emissions in Plating Process and Controls Method

The Generation of Emissions in Plating Process and Controls Method Plating operations generate mists due to the evolution of hydrogen and oxygen gas. The gases are formed in the process tanks on the surface of the submerged part or on anodes or cathodes. As these gas bubbles rise to the surface, they escape into the air and may carry considerable liquid with them in the form of a fine mist. The rate of gassing is a function of the chemical or electrochemical activity in the tank and increases with the amount of work in the tank, th

 Application of Rhodium Electroplating

Application of Rhodium Electroplating

Application of Rhodium Electroplating Rhodium plating traditionally has been used as decorative plating in jewelry and silverware. However, the use of rhodium plating for electronics and other industrial applications has been increasing in recent years. For decorative plating, rhodium baths contain 1.3 to 2.0 g/L of rhodium phosphate or rhodium sulfate concentrate and 25 to 80 ml/L of phosphoric or sulfuric acid. Current densities typically range from 20 to 100 A/m2. For industrial and electronic applications, rhodium plating

The Solutions Used for Palladium and Platinum Electroplating

The Solutions Used for Palladium and Platinum Electroplating

 The Solutions Used for Palladium and Platinum Electroplating Palladium plating solutions are categorized as ammoniacal, chelated, or acid. Ammoniacal palladium plating baths contain palladium ammonium nitrate or palladium ammonium chloride, and current densities range from 1 to 25 A/m2. Palladium acid plating baths contain palladium chloride, and current densities range from 1 to 10 A/m2. Palladium alloys readily with other metals, the most important of which is nickel. Palladium nickel electroplating baths contain 3 g/L o


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